ACM Research, Inc.

ACM Research develops and manufactures semiconductor processing equipment used in wafer fabrication and advanced packaging applications. The company's primary product lines include wet cleaning tools for front-end chip production, dry processing equipment, and packaging assembly tools. Its wet cleaning systems, marketed under brands such as SAPS and TEBO, are single-wafer serial-processing tools designed to remove defects from wafer surfaces and clean interconnects at process nodes of 28 nanometers or smaller. The company also offers the Ultra-C Tahoe cleaning tool, which reduces consumption of sulfuric acid and hydrogen peroxide compared to conventional high-temperature cleaning systems.

The company's advanced packaging segment provides equipment including coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating tools for wafer assembly and packaging customers. Additional product offerings include the Ultra Fn Furnace for dry processing, the Ultra Pmax PECVD tool for film uniformity applications, and the Ultra Track 300-millimeter process tool featuring customizable software for specific manufacturing requirements.

ACM Research operates with approximately 2,000 full-time employees and serves semiconductor manufacturers globally through a combination of direct sales and third-party representatives. The company was incorporated in California in 1998 and maintains headquarters in Fremont, California.